DR. KIRILL KLEIN

I worked as a power module architect, power core and gate driver design engineer, and an expert in the application and characterization of SiC and GaN power modules ranging from 2kW to 1MW.

I am highly driven, technically skilled, and results-oriented. An extraordinarily broad spectrum of knowledge from material sciences and manufacturing processes till analog electronics and application gives me a very broad overview of complex correlations. The ability to weigh them enables me to derive of breakthrough solutions with game-changing potential for the automotive industry.

Automotive mindset and attention to details in combination with strategic thinking (PI profile: strategist) enable me to recognize future needs and develop critical technologies, methods and solutions ahead of time.

The bandwidth of the support includes among others:

support at any step during development and characterization of power modules,
concept and development of measurement technics and automated measurement systems,
development and manufacturing of power core demonstrators and state-of-the art gate drivers,
consulting
teaching and know-how transfer

I offer

Expertise in power module design for automotive applications

electrical design
design incl. advanced water channel design
mechanical design
integration design for power and control paths

Performing of high-end dynamic measurements

debug of switching issues, e.g. parasitic turn-on, body diode snappiness
double-pulse testing, short-circuit testing, SOA verification
interpretation of the measurement data

Consulting
Tehnical corporate strategy / technical marketing
Professional training

I am interested in

Challenging projects and tasks
Networks related to power module design, chartacterization and measurement technics

Portfolio

Electrical design

electrical design

Thermal design

thermal design

Thermo-mechanical design

thermo-mechanical design

Manufacturing process flow concept

Landing Page

Inverter assembly flow concept

Landing Page

Static characterization

Landing Page

Dynamic characterization

Landing Page

Electrical QC design

Landing Page

Projects

(detailed descriptions of the projects below and performed tasks coming soon...)

PCB Embedded power packages

SiC power package for solar inverter (2014)

1200V, 4x25mm2 SiC/switch

integrated gate driver booster stage

< 3nH DC link inductance

HHK Power Module Project

GaN integrated power package (2015)

for Google Little Box Challenge

450V, 2x GaN GITs/switch

integrated booster stage and DC link

LittleBoxChallenge Project

SiC integrated power package (2017)

1200V, 100mm2 SiC/switch

integrated isolated gate driver

RC snubber and current sensor

Siplit Project

Mold power modules

SiC Prepackage in compression mold technology (2022)

1200V, upto 200mm2 SiC/switch

scalable power module platform

direct substrate cooling

Under NDA Project

SiC power module in transfer mold technology (2022)

1200V, 100mm2 SiC/switch

automotive PM with advanced cooling

<6nH overall Ldclink

under NDA2 Project

Case power modules

Magneti Marelli Formel F1/F-E SiC (2017)

1200V, 200mm2 SiC/switch

Formel 1 traction inverter

Enhanced Direct-cooling Inverter

Magneti Marelli Project

Hyb_idP.D.G2 with 30% less Rthjf (2022)

1200V, 200mm2 SiC

copper clip, std base plate

advanced water channel design

under NDA IPMD Project

Power discrete integration

GaN isolated power package (2016)

650V, 2x GS66508T

IMS substrate

integrated booster and RC snubber

EPCOS Project

ECPE "Lighthouse" msPEBB (2018)

modular scalable PE Building Block

Prepackage based 2-step packaging

and integrtation concepts

ECPE Lighthouse Programm

Wafer-level isolated BGA (2014)

Project: E2CoGaN

2x GaN per switch

isolated AlN substrate

embedding into 300mm Si-frame wafer

E2CoGaN

LTCC+SiN embedded power module

Project: Hitachi Metals Ltd

1200V, 50mm2 SiC/switch

integrated cooled RC snubber

integrtated 150C gate booster

Hitachi MEtals Ltd Project

Advanced cooling design

3D printed Aluminum cooler (2019)

direct thermal path concept

less thermal spreading at lower Rthjf

cooled DC link RC snubber

HML Project

optimized water channel for conventional pin-fin cooler (2022)

equally destributed die positions

-30% Rthjf

<5K thermal spreading for all 48 dies

IPMD Project 3

Measurement technics and techniques

Current sensor

500MHz

Current sensor

Large signal capacitance and ESR characterization

dissertation chapter

Parasitic inductance measurement by resonance method

dissertation chapter

Wire-bond contact resistance

Wire-bond contact resistance Project

CONTACT

Address: -on request-
Berlin, Germany

Phone: -on request-

E-Mail:

Internet: www.ipmdesign.de

LinkedIn

PUBLICATIONS & POSTERS & PRESENTATIONS

[TU BERLIN] K.KLEIN DISERTATION "Electromagnetic switching cell design for fast switching semiconductors" 2023, TU BERLIN

[IEEE] K. Klein, "Electromagnetic switching cell design for fast switching semiconductors," in CIPS 2022, Berlin.

invited speaker: K.Klein, "Driver Integration for Fast Switching WBG Power Modules,"
ECPE Workshop "Advanced Drivers for Si, SiC and GaN Power Semiconductor Devices", Online, 15-16.02.2022

[IET] Co-Autor of Book "Modern Power Electronic Devices: Physics, applications, and reliability" (pp.385-416), Hoene, E.& Klein, K. (2020). Chapter 12: Switching cell design. DOI:10.1049/PBPO152E

[IEEE] K. Klein, E. Hoene and K. Lang, "Electromagnetic switching cell design and characterization for WBG power semiconductors," CIPS 2020, Berlin.

[IEEE] Young Engineer Award Winner 2021 K. Klein et al., "Low inductive full ceramic SiC power module for high-temperature automotive applications," PCIM Europe digital days 2020; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2020

invited speaker: K.Klein "Evolution of low-inductive power modules"
Workshop SCAPE 2019 - Applications of power electronics, 13-14.05.2019, Stockholm, Sweden

[IEEE] K.Klein, E. Hoene, K. D. Lang, "Power module design for utilizing of WBG switching performance", in PCIM Europe 2019; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, May 2019

[IEEE] C.-A. Manier, K. Klein, F. Wüst, R. Gernhardt, P. Cussac, S. Andzouana, R. Mitova, H. Oppermann, K.-D. Lang, "Wafer Level Embedding Technology for Packaging of Planar GaN Half-Bridge Module in High Power Density Conversion Applications.," PCIM Europe 2018; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, Germany, 2018, pp. 1-8.

invited speaker: K. Klein, E. Hoene, "High Speed Current Measurements for Ultra Low inductance Power Modules",
ECPE Workshop "Current Measurement for Power Electronics Applications and in Lab Scale" 17/18.10.2017

[IEEE] K. Klein, E. Hoene and K. D. Lang, "Comprehensive AC Performance Analysis of Ceramic Capacitors for DC Link Usage,"
PCIM Europe 2017; International Exhibition and Conference for Power Electronics, Intelligent Motion,
Renewable Energy and Energy Management, Nuremberg, Germany, 2017, pp. 1-7.

[IEEE] D. Cittanti, F. Iannuzzo, E. Hoene and K. Klein, "Role of parasitic capacitances in power MOSFET turn-on switching speed limits: A SiC case study,"
2017 IEEE Energy Conversion Congress and Exposition (ECCE), Cincinnati, OH, 2017, pp. 1387-1394

[IEEE] K. Klein, E. Hoene, R. Reiner and R. Quay, "Study on Packaging and Driver Integration with GaN Switches for Fast Switching,"
CIPS 2016; 9th International Conference on Integrated Power Electronics Systems, Nuremberg, Germany, 2016, pp. 1-6.

[IEEE] K. Klein, E. Hoene, K.-D. Lang, "Packages for Fast Switching HV GaN Power Devices,"
PCIM Europe 2014; International Exhibition and Conference for Power Electronics, Intelligent Motion,
Renewable Energy and Energy Management, Nuremberg, Germany, 2014, pp. 1-7

K. Klein, E. Hoene "Packagedesign für schnelles Schalten" Elektronik Praxis 23.04.14
"Technological approaches towards high voltage, fast switching GaN power transistors"

[IOP] J. Würfl, O. Hilt, E. Bahat-Treidel, R. Zhytnytska, K. Klein, P. Kotara, F. Brunner, A. Knauer, O. Krüger, M. Weyersa and G. Tränkle, "Technological approaches towards high voltage, fast switching GaN power transistors" ECS Trans., vol. 52, no. 1, 979-989 (2013)

Current Sensor
GTC /AGB (German)

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